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We claim the ornamental design for an earphone headset, as shown and described.
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FIG. 1 is a perspective view of an earphone headset of the design as seen from the front and one side with the boom and the connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 2 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 3 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 4 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 5 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 6 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 7 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 8 is a perspective view of a modified embodiment of the earphone headset of the design as seen from the front and one side with boom and the connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 9 is a front elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 10 is a rear elevation view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 11 is a side elevation view as seen from left to right of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 12 is a side elevation view as seen from right to left of the view shown in FIG. 2 with the boom and connection wiring shown in dotted lines that form no part of the claimed invention;
FIG. 13 is a top plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention; and,
FIG. 14 is a bottom plan view thereof with the boom and connection wiring shown in dotted lines that form no part of the claimed invention.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 04 2002 | PHAM, HOA | TELEX COMMUNICATIONS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012546 | /0773 | |
Jan 04 2002 | MINNESOTA, MINNEAPOLIS | TELEX COMMUNICATIONS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012546 | /0773 | |
Jan 04 2002 | LARDY, JASON | TELEX COMMUNICATIONS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012546 | /0773 | |
Jan 04 2002 | MINNESOTA, WOODBURY | TELEX COMMUNICATIONS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 012546 | /0773 | |
Jan 24 2002 | Telex Communications, Inc. | (assignment on the face of the patent) | / | |||
Nov 19 2003 | TELEX COMMUNICATIONS, INC | BNY MIDWEST TRUST COMPANY | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 014836 | /0286 | |
Nov 19 2003 | TELEX COMMUNICATIONS, INC | GENERAL ELECTRIC CAPITAL CORPORATION, AS AGENT | SECURITY INTEREST SEE DOCUMENT FOR DETAILS | 014137 | /0607 | |
Nov 19 2003 | TELEX COMMUNICATIONS HOLDINGS, INC | TELEX COMMUNICATIONS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014137 | /0543 | |
Nov 19 2003 | TELEX COMMUNICATIONS, INC | TELEX COMMUNICATIONS HOLDINGS, INC | CHANGE OF NAME SEE DOCUMENT FOR DETAILS | 014137 | /0522 | |
Aug 29 2006 | General Electric Capital Corporation | TELEX COMMUNICATIONS, INC | SECURITY INTEREST RELEASE | 018917 | /0957 | |
Aug 30 2006 | BNY MIDWEST TRUST COMPANY | TELEX COMMUNICATIONS, INC | SECURITY INTEREST RELEASE | 018917 | /0957 |
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