Patent
   D872706
Priority
Jan 22 2018
Filed
Jul 18 2018
Issued
Jan 14 2020
Expiry
Jan 14 2035
Assg.orig
Entity
unknown
9
51
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a front elevational view of a headphone;

FIG. 2 is a rear elevational view of the headphone;

FIG. 3 is a top plan view of the headphone;

FIG. 4 is a bottom plan view of the headphone;

FIG. 5 is a left side elevational view of the headphone;

FIG. 6 is a right side elevational view of the headphone;

FIG. 7 is a top side perspective view of the headphone;

FIG. 8 is a bottom side perspective view of the headphone; and,

FIG. 9 is a reference view showing a state of use of the headphone.

Portions of the drawings shown in broken lines form no part of the claimed design.

Araki, Shohei, Takubo, Yosuke

Patent Priority Assignee Title
D888010, Dec 28 2017 Harman International Industries, Incorporated Headphone
D916047, Mar 27 2018 BEIJING XIAOMI MOBILE SOFTWARE CO., LTD. Gaming headphones
D949822, Nov 01 2019 JVCKENWOOD Corporation Headphone
D974325, Mar 31 2021 Headphone
ER5524,
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ER9933,
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 07 2018ARAKI, SHOHEIAudio-Technica CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0463830397 pdf
Jul 06 2018TAKUBO, YOSUKEAudio-Technica CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0463830397 pdf
Jul 18 2018Audio-Technica Corporation(assignment on the face of the patent)
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