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The ornamental design for headphones, as shown and described. |
FIG. 1 is a front elevational view of headphones showing my new design;
FIG. 2 is a right side elevational view;
FIG. 3 is a top plan view;
FIG. 4 is a rear elevational view;
FIG. 5 is a left side elevational view;
FIG. 6 is a bottom plan view;
FIG. 7 is a front bottom and left side perspective view; and
FIG. 8 is a perspective view in folded position.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 13 1981 | SAITO, TOMONAGA | SONY CORPORATION, 7-35 KITASHINAGAWA 6-CHOME SHINAGAWA-KU,TOKYO, JAPAN A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 003911 | /0004 | |
Aug 19 1981 | Sony Corporation | (assignment on the face of the patent) | / |
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