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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a front elevation of a headphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevation thereof;
FIG. 4 is a right side elevation thereof;
FIG. 5 is a rear elevation thereof;
FIG. 6 is a bottom plan view thereof; and
FIG. 7 is a perspective view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 10 1982 | SAITO, TOMONAGA | SONY CORPORATION, 7-35 KITASHINAGAWA 6-CHOME, SHINAGAWA-KU, TOKYO, | ASSIGNMENT OF ASSIGNORS INTEREST | 004047 | /0143 | |
Sep 22 1982 | Sony Corporation | (assignment on the face of the patent) | / |
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