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The ornamental design for an earphone, as shown. |
FIG. 1 is a front elevational view of an earphone, showing our new design;
FIG. 2 is a cross-sectional elevational view thereof, taken along section lines 2--2 in FIG. 1;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 09 1989 | DAIDO, TAKEFUMI | SONY CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005019 | /0151 | |
Jan 09 1989 | KATO, KAZUE | SONY CORPORATION, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 005019 | /0151 | |
Jan 12 1989 | Sony Corporation | (assignment on the face of the patent) | / |
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