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The ornamental design for an earphone, as shown and described. |
FIG. 1 is a front elevational view of an earphone, showing my new design;
FIG. 2 is a rear elevational view thereof;
FIG. 3 is a left-side elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a top plan view thereof; and
FIG. 6 is a bottom plan view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 17 1987 | Sony Corporation | (assignment on the face of the patent) | / | |||
Mar 29 1988 | DAIDO, TAKEFUMI | Sony Corporation, | ASSIGNMENT OF ASSIGNORS INTEREST | 005050 | /0330 |
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