|
The ornamental design for a combined earphone and receiver, as shown and described. |
FIG. 1 is an enlarged top, front and left-side perspective view of a combined earphone and receiver, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and
FIG. 7 is a bottom plan view thereof.
The connecting wire is broken away in the drawings for ease of illustration .
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Oct 17 1988 | SOGABE, TAKASHI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 004972 | /0475 | |
Nov 07 1988 | Sony Corporation | (assignment on the face of the patent) | / |
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