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The ornamental design for an earphone, as shown. |
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FIG. 1 is a front elevational view of an earphone showing my new design;
FIG. 2 is a cross sectional elevational view thereof, taken along section lines 2--2 in FIG. 1;
FIG. 3 is a left-side elevational view thereof;
FIG. 4 is a right-side elevational view thereof;
FIG. 5 is a top plan view thereof; and
FIG. 6 is a bottom plan view thereof.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
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| Jun 01 1989 | Sony Corporation | (assignment on the face of the patent) | / |
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