Patent
   D599777
Priority
Nov 02 2007
Filed
Mar 20 2008
Issued
Sep 08 2009
Expiry
Sep 08 2023
Assg.orig
Entity
unknown
20
43
n/a
The ornamental design for a headphone, as shown and described.

FIG. 1 is a perspective view of a headphone showing my new design in an open position;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof; and

FIG. 7 is a left side elevational view thereof.

FIG. 8 is a bottom perspective view of the headphone of FIG. 1 in a closed position;

FIG. 9 is an opposite side end elevational view of FIG. 8 thereof;

FIG. 10 is a rear elevational view thereof;

FIG. 11 is a top plan view thereof;

FIG. 12 is a bottom plan view thereof;

FIG. 13 is a right side elevational view thereof;

FIG. 14 is a left side elevational view thereof;

FIG. 15 is a perspective view of the headphone of FIG. 1 in an open position, wherein the cord is enclosed from the slit formed along the elongated connecting part; and,

FIG. 16 is a perspective view of a headphone of FIG. 1 in an open position, wherein the cord is extracted from the slit formed along the elongated connecting part.

The portions indicated in broken lines are for illustrative purposes only and form no part of the claimed design.

The broken away lines in the drawing disclosure indicate indeterminate length of the cable connected to the headphone, which is not claimed.

Yuyama, Yasuo

Patent Priority Assignee Title
D678856, Nov 08 2011 Harman International Industries, Incorporated Behind the neck wireless headset
D678857, Nov 08 2011 Harman International Industries, Incorporated Behind the neck wireless headset
D678858, Nov 08 2011 Harman International Industries, Incorporated Behind the neck wireless headset
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Mar 19 2008YUYAMA, YASUOSony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0207400192 pdf
Mar 20 2008Sony Corporation(assignment on the face of the patent)
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