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The ornamental design for an earphone, as shown and described.
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FIG. 1 is a perspective view of an earphone showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is an enlarged left side view thereof; and,
FIG. 9 is an enlarged right side view thereof.
Masamitsu, Satoshi, Tsuboki, Keitaro
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| May 31 2001 | MASAMITSU, SATOSHI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011966 | /0770 | |
| Jun 07 2001 | TSUBOKI, KEITARO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011966 | /0770 | |
| Jul 02 2001 | Sony Corporation | (assignment on the face of the patent) | / |
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