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The ornamental design for a head assembly for a printed circuit board test fixture, as shown and described. |
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FIG. 1 is a perspective view of a printed circuit board test fixture embodying my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view, the right side elevational view being a mirror image;
FIG. 4 is a bottom plan view thereof; and,
FIG. 5 is a front elevational view, the rear elevational view being a mirror image thereof.
Nesbitt, Robert J., Seavey, Bruce A.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Mar 05 1992 | NESBITT, ROBERT J | TTI TESTRON, INC | ASSIGNMENT OF ASSIGNORS INTEREST | 006052 | /0477 | |
| Mar 05 1992 | SEAVEY, BRUCE A | TTI TESTRON, INC | ASSIGNMENT OF ASSIGNORS INTEREST | 006052 | /0477 | |
| Mar 09 1992 | TTI TesTron, Inc. | (assignment on the face of the patent) | / | |||
| Sep 08 1999 | TTI TESTRON, INC | Delaware Capital Formation, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010288 | /0139 |
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