Patent
   D511981
Priority
Mar 23 2004
Filed
Mar 23 2004
Issued
Nov 29 2005
Expiry
Nov 29 2019
Assg.orig
Entity
unknown
1
3
n/a
The ornamental design for a semiconductor integrated circuit test head, as shown and described.

FIG. 1 is a perspective view of a semiconductor integrated circuit test head showing my new design,

FIG. 2 is an end elevation thereof, the opposite end elevation being of corresponding appearance,

FIG. 3 is a side elevation thereof; and,

FIG. 4 is a top plan view thereof.

Sun, IChiang, Miller, Wayne H.

Patent Priority Assignee Title
D929248, Oct 10 2019 Aukey Technology Co., Ltd Laser level
Patent Priority Assignee Title
6642729, Jun 16 2001 Samsung Electronics Co., Ltd. Probe card for tester head
D345705, Mar 09 1992 Delaware Capital Formation, Inc Head assembly for a printed circuit board test fixture
D369983, Jun 12 1995 Hickok Incorporated Capacitive electronic sensor head
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Mar 18 2004MILLER, WAYNE H Credence Systems CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0145130308 pdf
Mar 23 2004Credence Systems Corporation(assignment on the face of the patent)
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