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The ornamental design for a package for a headphone, as shown. |
FIG. 1 is a top, front and right-side perspective view of a package for a headphone, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Nagasaka, Yoshie, Suzuki, Yuko, Ichikawa, Toru, Wada, Yuko, Tave, Ellen, Yin, Rosalin
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 09 1993 | ICHIKAWA, TORU | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006454 | /0074 | |
Feb 09 1993 | WADA, YUKO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006454 | /0074 | |
Feb 09 1993 | SUZUKI, YUKO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006454 | /0074 | |
Feb 09 1993 | TAVE, ELLEN | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006454 | /0074 | |
Feb 09 1993 | YIN, ROSALIN | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006454 | /0074 | |
Feb 09 1993 | NAGASAKA, YOSHI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST | 006454 | /0074 | |
Mar 04 1993 | Sony Corporation | (assignment on the face of the patent) | / |
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