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The ornamental design for a packaging assembly, as shown and described. |
FIG. 1 is an exploded view of a packaging assembly embodying my design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a back elevational view thereof;
FIG. 4 is a right elevational view thereof, the left elevational view being a mirror image thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a cross-sectional view taken along line 7--7 in FIG. 2;
FIG. 8 is a perspective view thereof;
FIG. 9 is an exploded view of an alternate embodiment of my design; and,
FIG. 10 is a perspective view thereof.
The corresponding views of the second embodiment (FIG. 9) are similar to the views of the first embodiment (FIG. 1) FIGS. 2-8 inclusive with the exception of transparent surface.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Aug 30 1994 | WADA, YUKO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007130 | /0296 | |
Sep 08 1994 | Sony Corporation | (assignment on the face of the patent) | / |
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