Patent
   D367848
Priority
Jun 30 1994
Filed
Dec 29 1994
Issued
Mar 12 1996
Expiry
Mar 12 2010
Assg.orig
Entity
unknown
2
8
n/a
The ornamental design for a module for receiving an infra-red signal of a remote controller, as shown and described.

FIG. 1 is a perspective view of a first embodiment of the module for receiving an infra-red signal of a remote controller of the present invention showing our new design;

FIG. 2 is a front plan view of the first embodiment of FIG. 1;

FIG. 3 is a rear plan view of the first embodiment of FIG. 1;

FIG. 4 is a top plan view of the first embodiment of FIG. 1;

FIG. 5 is a bottom plan view of the first embodiment of FIG. 1;

FIG. 6 is a right side plan view of the first embodiment of FIG. 1; the left side plan view is symmetrically identical to FIG. 6 and is therefore not shown;

FIG. 7 is a perspective view of the second embodiment of the module for receiving infra-red signal of a remote controller of the present invention showing our new design;

FIG. 8 is a front plan view of the second embodiment of FIG. 7;

FIG. 9 is a rear plan view of the second embodiment of FIG. 7;

FIG. 10 is a top plan view of the second embodiment of FIG. 7;

FIG. 11 is a bottom plan view of the second embodiment of FIG. 7; and,

FIG. 12 is a right plan view of the second embodiment of FIG. 7; the left plan view is symmetrically identical to FIG. 12 and is therefore not shown .

Takamatsu, Hiroyuki, Yamashita, Takanori, Harada, Yoshio, Shimada, Toshiyasu

Patent Priority Assignee Title
D497879, Feb 13 2003 Sharp Kabushiki Kaisha Infrared sensor
D635939, Sep 22 2009 Everlight Electronics Co., Ltd. Light emitting diode assembly
Patent Priority Assignee Title
4650998, Dec 10 1984 VISHAY INFRARED COMPONENTS Highly aligned optical device
4704525, Dec 28 1982 ALPS Electric Co., Ltd. Construction for positioning photosensor devices
4967312, Apr 24 1987 Sharp Kabushiki Kaisha Case for circuit board with light-receiving element
5013911, May 27 1988 Oki Electric Industry Co., Ltd. Optical sensor unit with sealed optical element and cable connector
5032953, Aug 15 1990 PULSE ELECTRONICS, INC Surface mounted single in-line electronic component package with mounting projections and chamfered viewing edge
5302778, Aug 28 1992 Eastman Kodak Company; EASTMAN KODAK COMPANY A NJ CORP Semiconductor insulation for optical devices
5365062, Oct 05 1992 Eaton Corporation Photoelectric sensor assembly with transparent housing an integrally molded lens
D278049, Oct 30 1981 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 29 1994Sony Corporation(assignment on the face of the patent)
Mar 31 1995HARADA, YOSHIOSony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
Mar 31 1995TAKAMATSU, HIROYUKISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
Mar 31 1995HARADA, YOSHIONEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
Mar 31 1995TAKAMATSU, HIROYUKINEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
Apr 13 1995SHIMADA, TOSHIYASUSony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
Apr 13 1995YAMASHITA, TAKANORISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
Apr 13 1995SHIMADA, TOSHIYASUNEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
Apr 13 1995YAMASHITA, TAKANORINEC CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0074720852 pdf
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