| 
 | The ornamental design for a light-emitting diode semiconductor chip with leads, substantially as shown and described. | |||||||||||||||||
FIG. 1 is a perspective view of a light-emitting diode semiconductor chip with leads showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a side elevational view thereof, as seen from the right side of FIG. 1;
FIG. 4 is a side elevational view thereof, as seen from the left side of FIG. 1;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a perspective view of a light-emitting diode semiconductor chip with leads showing the second embodiment of our new design;
FIG.8 is a front elevational view thereof;
FIG. 9 is a side elevational view thereof, as seen from the right side of FIG. 7;
FIG. 10 is a side elevational view thereof, as seen from the left side of FIG. 7;
FIG. 11 is a top plan view thereof; and
FIG. 12 is a bottom plan view thereof.
Koyama, Minoru, Takahashi, Kaoru
| Patent | Priority | Assignee | Title | 
| D364603, | Jun 20 1994 | Sanyo Electric Co., Ltd.; Tottori Sanyo Electric Co., Ltd. | Light receiving module | 
| D364604, | Jul 27 1994 | Sanyo Electric Co., Ltd.; Totori Sanyo Electric Co., Ltd. | Light receiving module | 
| D367848, | Jun 30 1994 | Sony Corporation; NEC Corporation | Module for receiving infra-red signal of remote controller | 
| D373759, | Jun 20 1994 | Sanyo Electric Co., Ltd.; Tottori Sanyo Electric Co., Ltd. | Light receiving module | 
| D462334, | Sep 25 2000 | Citizen Electronics Co., Ltd. | Light emitting diode | 
| D476296, | Sep 06 2001 | Sharp Kabushiki Kaisha | Semiconductor device | 
| D481689, | Mar 06 2002 | Sharp Kabushiki Kaisha | Semiconductor device | 
| D497879, | Feb 13 2003 | Sharp Kabushiki Kaisha | Infrared sensor | 
| D503930, | Sep 15 2003 | Nichia Corporation | Light emitting diode | 
| D505397, | Sep 15 2003 | Nichia Corporation | Light emitting diode | 
| D510912, | Sep 15 2003 | Nichia Corporation | Light emitting diode | 
| D517025, | Mar 17 2003 | Nichia Corporation | Light emitting diode | 
| D635939, | Sep 22 2009 | Everlight Electronics Co., Ltd. | Light emitting diode assembly | 
| D877707, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package | 
| D908646, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package | 
| D908647, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package | 
| D909317, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package | 
| D909318, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package | 
| D984001, | Jun 01 2022 | Shangyou Jiayi Lighting Product Co., Ltd. | Light emitting diode | 
| Patent | Priority | Assignee | Title | 
| 2817046, | |||
| 2986678, | |||
| 3458779, | |||
| 3510732, | |||
| 3774086, | |||
| 3962719, | Dec 05 1974 | Plastronics, Inc. | Mounting pad and semiconductor encapsulation device combination | 
| 4143394, | Jul 30 1976 | Telefunken Electronic GmbH | Semiconductor luminescence device with housing | 
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc | 
| Apr 21 1982 | TAKAHASHI, KAORU | STANLEY ELECTRIC CO , LTD , A COMPANY OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 003998/ | 0004 | |
| Apr 21 1982 | KOYAMA, MINORU | STANLEY ELECTRIC CO , LTD , A COMPANY OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 003998/ | 0004 | |
| Apr 28 1982 | Stanley Electric Co., Ltd. | (assignment on the face of the patent) | / | 
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