Patent
   D476296
Priority
Sep 06 2001
Filed
Mar 06 2002
Issued
Jun 24 2003
Expiry
Jun 24 2017
Assg.orig
Entity
unknown
13
6
n/a
The ornamental design for a "semiconductor device", as shown and described.

FIG. 1 is a top, front and right side perspective view of a semiconductor device according to my design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view being a mirror image thereof;

FIG. 7 is a view of a further embodiment of a semiconductor device similar to FIG. 1, the broken lines illustrating environmental structure of this embodiment which does not form part of the design of this embodiment;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof; and,

FIG. 12 is a right side elevational view thereof, the left side elevational view being a mirror image thereof.

Koizumi, Hideshi

Patent Priority Assignee Title
7889770, Mar 25 2002 PANASONIC SEMICONDUCTOR SOLUTIONS CO , LTD Semiconductor laser device
D483338, Jul 10 2002 Mitsubishi Denki Kabushiki Kaisha Optical module
D484105, Jul 10 2002 Mitsubishi Denki Kabushiki Kaisha Optical module
D494147, Jul 10 2002 Mitsubishi Denki Kabushiki Kaisha Optical module
D505664, Jul 10 2002 Mitsubishi Denki Kabushiki Kaisha Optical package
D506450, Aug 27 2003 Kabushiki Kaisha Toshiba Optical semiconductor device
D742842, Mar 24 2014 LEM International SA Electrical current transducer
D877707, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D908646, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D908647, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D909317, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D909318, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D984001, Jun 01 2022 Shangyou Jiayi Lighting Product Co., Ltd. Light emitting diode
Patent Priority Assignee Title
5485479, Nov 07 1990 FUJI ELECTRIC CO , LTD Semiconductor laser device encapsulated in a transparent resin layer
5604372, Aug 30 1994 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor apparatus
5748658, Oct 22 1993 MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD Semiconductor laser device and optical pickup head
6034424, Jul 31 1996 Sumitomo Electric Industries, Ltd. Package and optoelectronic device
D278049, Oct 30 1981 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
D280812, May 07 1982 Stanley Electric Co., Ltd. Light-emitting diode semiconductor chip with leads
//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Mar 06 2002Sharp Kabushiki Kaisha(assignment on the face of the patent)
Mar 20 2002KOIZUMI, HIDESHISharp Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0128980683 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule