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The ornamental design for a optical package, as shown and described.
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FIG. 1 is a front, top and right side perspective view of a optical package, showing our new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical package, showing our new design;
FIG. 8 is a front elevational view thereof;
FIG. 9 is a rear elevational view thereof;
FIG. 10 is a top plan view thereof;
FIG. 11 is a bottom plan view thereof;
FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;
FIG. 13 is a front, top and right side perspective view of a third embodiment of the optical package, showing our new design;
FIG. 14 is a front elevational view thereof;
FIG. 15 is a rear elevational view thereof;
FIG. 16 is a top plan view thereof;
FIG. 17 is a bottom plan view thereof; and,
FIG. 18 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.
The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.
Sakai, Kiyohide, Takagi, Shinichi, Aruga, Hiroshi
Patent | Priority | Assignee | Title |
10431955, | Apr 25 2014 | LMD Applied Science, LLC | Laser core having conductive mass electrical connection |
11340412, | Feb 28 2020 | CIG PHOTONICS JAPAN LIMITED | Optical module |
11456393, | Dec 17 2019 | CIG PHOTONICS JAPAN LIMITED | Optical module |
7158550, | Jun 04 2003 | Samsung Electronics Co., Ltd. | Optical element module package and method for manufacturing the same |
8611094, | Jul 08 2010 | Mitsubishi Electric Corporation | Optical module |
D879767, | May 30 2017 | KOHOKU KOGYO CO., LTD. | Optical communication module |
D879768, | May 30 2017 | KOHOKU KOGYO CP., LTD. | Optical communication module |
D908646, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package |
D908647, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package |
D909317, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package |
D909318, | Mar 30 2017 | Mitsubishi Electric Corporation | Semiconductor package |
ER2428, |
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Jan 03 2003 | Mitsubishi Denki Kabushiki Kaisha | (assignment on the face of the patent) | / | |||
Feb 12 2003 | TAKAGI, SHINICHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013838 | /0490 | |
Feb 12 2003 | ARUGA, HIROSHI | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013838 | /0490 | |
Feb 12 2003 | SAKAI, KIYOHIDE | Mitsubishi Denki Kabushiki Kaisha | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 013838 | /0490 |
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