Patent
   D505664
Priority
Jul 10 2002
Filed
Jan 03 2003
Issued
May 31 2005
Expiry
May 31 2019
Assg.orig
Entity
unknown
12
9
n/a
The ornamental design for a optical package, as shown and described.

FIG. 1 is a front, top and right side perspective view of a optical package, showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 7 is a front, top and right side perspective view of a second embodiment of the optical package, showing our new design;

FIG. 8 is a front elevational view thereof;

FIG. 9 is a rear elevational view thereof;

FIG. 10 is a top plan view thereof;

FIG. 11 is a bottom plan view thereof;

FIG. 12 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof;

FIG. 13 is a front, top and right side perspective view of a third embodiment of the optical package, showing our new design;

FIG. 14 is a front elevational view thereof;

FIG. 15 is a rear elevational view thereof;

FIG. 16 is a top plan view thereof;

FIG. 17 is a bottom plan view thereof; and,

FIG. 18 is a right side elevational view thereof, the left side elevational view is omitted as that is symmetrical to the right side elevational view thereof.

The broken lines in all views are shown for illustrative purposes only and form no part of the claimed design.

Sakai, Kiyohide, Takagi, Shinichi, Aruga, Hiroshi

Patent Priority Assignee Title
10431955, Apr 25 2014 LMD Applied Science, LLC Laser core having conductive mass electrical connection
11340412, Feb 28 2020 CIG PHOTONICS JAPAN LIMITED Optical module
11456393, Dec 17 2019 CIG PHOTONICS JAPAN LIMITED Optical module
7158550, Jun 04 2003 Samsung Electronics Co., Ltd. Optical element module package and method for manufacturing the same
8611094, Jul 08 2010 Mitsubishi Electric Corporation Optical module
D879767, May 30 2017 KOHOKU KOGYO CO., LTD. Optical communication module
D879768, May 30 2017 KOHOKU KOGYO CP., LTD. Optical communication module
D908646, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D908647, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D909317, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
D909318, Mar 30 2017 Mitsubishi Electric Corporation Semiconductor package
ER2428,
Patent Priority Assignee Title
4768070, Mar 20 1986 OpNext Japan, Inc Optoelectronics device
5052009, Aug 18 1989 SONY CORPORATION, 7-35 KITASHINAGAWA-6, SHINAGAWA-KU, TOKYO, JAPAN A CORP OF JAPAN Semiconductor laser device and process of assembling the same
5252856, Sep 26 1990 Renesas Electronics Corporation Optical semiconductor device
5814871, Aug 15 1996 Fujitsu Ltd. Optical semiconductor assembly having a conductive float pad
6181720, Jan 16 1997 Renesas Electronics Corporation Semiconductor laser device and method for manufacturing same
6479889, Sep 04 1998 Sony Corporation Semiconductor device package, and fabrication method thereof
6577656, Mar 13 2001 II-VI Incorporated; MARLOW INDUSTRIES, INC ; EPIWORKS, INC ; LIGHTSMYTH TECHNOLOGIES, INC ; KAILIGHT PHOTONICS, INC ; COADNA PHOTONICS, INC ; Optium Corporation; Finisar Corporation; II-VI OPTICAL SYSTEMS, INC ; M CUBED TECHNOLOGIES, INC ; II-VI PHOTONICS US , INC ; II-VI DELAWARE, INC; II-VI OPTOELECTRONIC DEVICES, INC ; PHOTOP TECHNOLOGIES, INC System and method of packaging a laser/detector
6587491, Oct 06 1999 Rohm Co., Ltd. Semiconductor laser
D476296, Sep 06 2001 Sharp Kabushiki Kaisha Semiconductor device
////
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jan 03 2003Mitsubishi Denki Kabushiki Kaisha(assignment on the face of the patent)
Feb 12 2003TAKAGI, SHINICHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138380490 pdf
Feb 12 2003ARUGA, HIROSHIMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138380490 pdf
Feb 12 2003SAKAI, KIYOHIDEMitsubishi Denki Kabushiki KaishaASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0138380490 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule