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The ornamental design for a "semiconductor device", as shown and described.
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FIG. 1 is a top, front, and right perspective of a semiconductor device showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a top plan view thereof;
FIG. 5 is a bottom plan view; and,
FIG. 6 is a right side elevational view, the left side elevational view being a mirror image thereof.
The broken line showing of the environment is for illustrative purpose only and forms no part of the claimed design.
| Patent | Priority | Assignee | Title |
| Patent | Priority | Assignee | Title |
| 5485479, | Nov 07 1990 | FUJI ELECTRIC CO , LTD | Semiconductor laser device encapsulated in a transparent resin layer |
| 5604372, | Aug 30 1994 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor pressure sensor apparatus |
| 5748658, | Oct 22 1993 | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | Semiconductor laser device and optical pickup head |
| 6034242, | Jun 06 1995 | Allergan, Inc | 2,4-pentadienoic acid derivatives having retinoid-like biological activity |
| D278049, | Oct 30 1981 | Stanley Electric Co., Ltd. | Light-emitting diode semiconductor chip with leads |
| D280812, | May 07 1982 | Stanley Electric Co., Ltd. | Light-emitting diode semiconductor chip with leads |
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| Mar 11 2003 | Sharp Kabushiki Kaisha | (assignment on the face of the patent) | / |
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