Patent
   D375725
Priority
Feb 28 1996
Filed
Feb 28 1996
Issued
Nov 19 1996
Expiry
Nov 19 2010
Assg.orig
Entity
unknown
17
8
n/a
The ornamental design for a cooling device, as shown and described.

FIG. 1 is a perspective view of the top of a cooling device showing my new design;

FIG. 2 is a left side elevational view thereof, the right side elevational view being a mirror image;

FIG. 3 is a front elevational view thereof, the rear view being a mirror image;

FIG. 4 is a top plan view thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a perspective view of an alternate embodiment of the cooling device of FIG. 1;

FIG. 7 is a left side elevational view thereof, the right side elevational view being a mirror image;

FIG. 8 is a front elevational view thereof, the rear view being a mirror image;

FIG. 9 is a top plan view thereof; and,

FIG. 10 is a bottom plan view thereof.

Dodson, Douglas A.

Patent Priority Assignee Title
6880349, Apr 12 2002 Schneider Electric IT Corporation Rack-mounted equipment cooling
7259963, Dec 29 2004 American Power Conversion Corporation Rack height cooling
7325410, Nov 19 2004 Schneider Electric IT Corporation IT equipment cooling
7403391, Dec 29 2004 American Power Conversion Corporation Rack height cooling
7418825, Nov 19 2004 Schneider Electric IT Corporation IT equipment cooling
D389807, Dec 30 1996 OCZ TECHNOLOGY GROUP, INC Cooling device
D398589, May 27 1997 OCZ TECHNOLOGY GROUP, INC Cooling device
D399831, Apr 29 1997 OCZ TECHNOLOGY GROUP, INC Cooling device
D425030, Mar 11 1999 Cooling fan of a heat sink assembly
D434394, Feb 25 1999 Seat for a cooling fan of a heat sink assembly
D598089, Mar 24 2009 CompTake Technology Inc. Heat dissipating fan
D632380, Mar 10 2009 Microsoft Corporation Cooling unit
D632775, Mar 10 2009 Microsoft Corporation Cooling unit
D873225, Dec 06 2017 Omron Corporation Heatsink
ER8598,
ER8791,
RE45111, Nov 19 2004 Schneider Electric IT Corporation IT equipment cooling
Patent Priority Assignee Title
5061822, Sep 12 1988 SAMSUNG ELECTRONICS CO , LTD Radial solution to chip carrier pitch deviation
5173819, Oct 05 1988 Hitachi Global Storage Technologies Japan, Ltd Disk apparatus having an improved cooling structure
5251101, Nov 05 1992 Dissipating structure for central processing unit chip
5285347, Jul 02 1990 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Hybird cooling system for electronic components
5309983, Jun 23 1992 PCUBID COMPUTER TECHNOLOGY INC Low profile integrated heat sink and fan assembly
D356777, Mar 26 1993 Fujitsu, Limited; PFU Limited Combined heat sink and fan
D357670, Aug 06 1993 OCZ TECHNOLOGY GROUP, INC Heat sink
D357900, Apr 01 1993 Fujitsu Limited Combined heat sink and fan
/
Executed onAssignorAssigneeConveyanceFrameReelDoc
May 25 2007DODSON, DOUGLAS A OCZ TECHNOLOGY GROUP, INC ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0194070072 pdf
n/a
Date Maintenance Fee Events


n/a
Date Maintenance Schedule