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The ornamental design for a cooling device, as shown and described. |
FIG. 1 is a perspective view of a first embodiment of a cooling device showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a right side elevational view thereof;
FIG. 4 is a front elevational view thereof, the rear elevational view being a mirror image;
FIG. 5 is a left side elevational view thereof; and,
FIG. 6 is a bottom plan view thereof.
Patent | Priority | Assignee | Title |
203543, | |||
D357670, | Aug 06 1993 | OCZ TECHNOLOGY GROUP, INC | Heat sink |
D367469, | Sep 19 1994 | Motorola, Inc | Heat sink |
D375725, | Feb 28 1996 | OCZ TECHNOLOGY GROUP, INC | Cooling device |
D378815, | Jun 19 1995 | OCZ TECHNOLOGY GROUP, INC | Heat sink |
D379799, | Sep 19 1994 | MOTOROLA SOLUTIONS, INC | Heat sink |
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May 25 2007 | DODSON, DOUGLAS A | OCZ TECHNOLOGY GROUP, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 019407 | /0072 | |
May 10 2012 | OCZ TECHNOLOGY GROUP, INC | WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT | SECURITY AGREEMENT | 028440 | /0866 | |
Mar 11 2013 | WELLS FARGO CAPITAL FINANCE, LLC, AS AGENT | OCZ TECHNOLOGY GROUP, INC | RELEASE BY SECURED PARTY SEE DOCUMENT FOR DETAILS | 030088 | /0443 |
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