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The ornamental design for a modem, as shown. |
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FIG. 1 is a perspective view of a modem embodying our new design;
FIG. 2 is a right side elevational view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jul 01 1996 | Hayes Microcomputer Products, Inc. | (assignment on the face of the patent) | / | |||
| Jul 01 1996 | HEBERLING, JAMES R | HAYES MICROCOMPUTER PRODUCTS, INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008301 | /0108 |
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