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The ornamental design for a "modem," as shown and described. |
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FIG. 1 shows a perspective view of the present design.
FIG. 2 shows a right elevational view of the present design.
FIG. 3 shows a top plan view of the present design.
FIG. 4 shows a front elevational view of the present design.
FIG. 5 shows a bottom plan view of the present design.
FIG. 6 shows a left elevational view of the present design; and,
FIG. 7 shows a rear elevational view of the present design.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jan 07 1999 | DU, SING-LONG | Askey Computer Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009770 | /0748 | |
| Jan 14 1999 | Askey Computer Corp. | (assignment on the face of the patent) | / |
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