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The ornamental design for a circuit board module, as shown. |
FIG. 1 is a face view of a circuit board module showing my new design;
FIG. 2 is a face view of a circuit board module showing my new design with a selection of devices shown in phantom;
FIG. 3 is a bottom view of a circuit board module showing my new design with a selection of devices shown in phantom;
FIG. 4 is a top, left side, isometric view of the circuit board module showing my new design;
FIG. 5 is a bottom, right side, isometric view of the bottom side of a circuit board module showing my new design;
FIG. 6 is a top, left side, isometric view of the circuit board module showing my new design with a selection of devices mounted to the board of the inventive design;
FIG. 7 is a bottom, right side, isometric view of the bottom side of a circuit board module showing my new design with a selection of devices mounted to the board of the inventive design;
FIG. 8 is a first side view of a circuit board module showing my new design;
FIG. 9 is a second side view of a circuit board module showing my new design; and,
FIG. 10 is a side view of a circuit board module as shown in FIG. 9 with a selection of devices shown in phantom.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jul 07 1995 | Giga Operations Corporation | (assignment on the face of the patent) | / | |||
Dec 01 1995 | TAYLOR, BRAD | Giga Operations Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007747 | /0659 |
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