Patent
   D396690
Priority
Feb 23 1996
Filed
Aug 23 1996
Issued
Aug 04 1998
Expiry
Aug 04 2012
Assg.orig
Entity
unknown
32
6
n/a
The ornamental design for an enclosure for electronic circuitry, as shown and described.

FIG. 1 is a top, front, right perspective view of an enclosure for electronic circuitry, such as a network interconnecting device like a multiport repeater, showing my new design;

FIG. 2 is a top, back, right perspective thereof;

FIG. 3 is a left side elevation thereof;

FIG. 4 is a right side elevation thereof;

FIG. 5 is a bottom plan view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a rear elevation thereof;

FIG. 8 is a front elevation thereof;

FIG. 9 is a top, front, right perspective view of an enclosure for electronic circuitry, such as a network interconnecting device like a multiport repeater, showing an alternative embodiment of my new design;

FIG. 10 is a top, back, right perspective of the alternative embodiment;

FIG. 11 is a front elevation of the alternative embodiment;

FIG. 12 is a rear elevation of the alternative embodiment;

FIG. 13 is a top plan view of the alternative embodiment;

FIG. 14 is a bottom plan view of alternative embodiment;

FIG. 15 is a right side elevation of the alternative embodiment; and,

FIG. 16 is a left side elevation of the alternative embodiment.

Fryers, Bruce

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Aug 23 19963Com Limited(assignment on the face of the patent)
Jan 06 1997FRYERS, BRUCE3Com LimitedASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0083390027 pdf
Apr 28 20103Com CorporationHewlett-Packard CompanyMERGER SEE DOCUMENT FOR DETAILS 0246300820 pdf
Apr 28 20103Com CorporationHewlett-Packard CompanyCORRECTIVE ASSIGNMENT TO CORRECT THE SEE ATTACHED0250390844 pdf
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