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The ornamental design for an outer surface of an electronic enclosure, as shown and described.
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FIG. 1 is a perspective view of an outer surface of an electronic enclosure showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a right side elevational view thereof; and,
FIG. 5 is a left side elevational view thereof.
No claim is made to the rear elevational view. The broken line showing of various features is for illustrative purposes only and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 06 2001 | Toshiba International Corporation | (assignment on the face of the patent) | / | |||
Mar 19 2001 | VACKAR, MARK A | Toshiba International Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011651 | /0174 |
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