Patent
   D405778
Priority
Nov 01 1996
Filed
Nov 01 1996
Issued
Feb 16 1999
Expiry
Feb 16 2013

TERM.DISCL.
Assg.orig
Entity
unknown
7
21
n/a
The ornamental design for a processor card assembly, as shown and described .

FIG. 1 is a perspective view of a processor card assembly including a cover having a hologram represented by cros-hatching affixed on a surface;

FIGS. 2-3 are front and left side views respectively thereof; and,

FIGS. 4-7 are the back, right side, top, and bottom views respectively thereof.

Klinker, Thomas S.

Patent Priority Assignee Title
D416886, Dec 24 1998 Honda Tsushin Kogyo Co., Ltd. Compact flash card
D449835, Oct 05 1999 Honda Tsushin Kogyo Co., Ltd. Compact flash card
D722601, Jan 30 2013 ADATA TECHNOLOGY CO., LTD. Detachable assembly of memory module
D772172, Jan 29 2014 Yokogawa Electric Corporation Signal I/O module
D866560, Jan 12 2018 Intel Corporation Peripheral component interconnect card panel
D868787, Oct 17 2017 Intel Corporation Peripheral component interconnect card with bracket
D876443, Jan 12 2018 Intel Corporation Peripheral component interconnect card panel set
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 01 1996Intel Corporation(assignment on the face of the patent)
Feb 27 1997KLINKER, THOMAS S Intel CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0084080698 pdf
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