Patent
   D772172
Priority
Jan 29 2014
Filed
Jul 25 2014
Issued
Nov 22 2016
Expiry
Nov 22 2030
Assg.orig
Entity
unknown
4
32
n/a
The ornamental design for a signal I/O module, as shown and described.

FIG. 1 is a front perspective view of a signal I/O module showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a perspective view thereof in use.

The broken lines shown are included for the purpose of illustrating the unclaimed portions of the signal I/O module and form no part of the claimed design.

Takano, Naoto, Senba, Noriaki, Kuraishi, Hiroki, Shimamura, Kouichirou

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 03 2014TAKANO, NAOTOYokogawa Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0333930399 pdf
Jul 03 2014SENBA, NORIAKIYokogawa Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0333930399 pdf
Jul 10 2014SHIMAMURA, KOUICHIROUYokogawa Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0333930399 pdf
Jul 11 2014KURAISHI, HIROKIYokogawa Electric CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0333930399 pdf
Jul 25 2014Yokogawa Electric Corporation(assignment on the face of the patent)
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