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The ornamental design for a communications module, as shown and described.
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FIG. 1 is a top, front, left side perspective view of the communications module;
FIG. 2 is a top, rear, left side perspective view of the communications module;
FIG. 3 is bottom, front, right side perspective view of the communications module;
FIG. 4 is bottom, rear, right side perspective view of the communications module;
FIG. 5 is a top plan view of the communications module;
FIG. 6 is a front elevation view of the communications module;
FIG. 7 is a rear elevation view of the communications module;
FIG. 8 is a right side elevation view of the communications module; and,
FIG. 9 is a left side elevation view of the communications module.
Laity, Ian A., Smither, Michael R.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Oct 15 2002 | Intel Corporation | (assignment on the face of the patent) | / |
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