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The ornamental design for a processor package, as shown and described. |
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FIG. 1 is a perspective view of a processor package including an indented area on a surface.
FIG. 2 is a front view of the processor package.
FIG. 3 is a top view thereof.
FIG. 4 is a back view of the processor package.
FIG. 5 is a right side view thereof.
FIG. 6 is a left side view thereof.
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken along line 8--8 of FIG. 2.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Dec 22 1997 | Intel Corporation | (assignment on the face of the patent) | / | |||
| Mar 31 1998 | KLINKER, THOMAS S | Intel Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009093 | /0027 |
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