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The ornamental design for a processor package cover plate for an integrated circuit processor package chipset, as shown and described. |
FIG. 1 is a perspective view of a processor package cover plate for an integrated circuit processor package chipset;
FIG. 2 is a front view thereof.
FIG. 3 is a top view thereof.
FIG. 4 is a back view thereof.
FIG. 5 is a right side view thereof.
FIG. 6 is a left side view thereof.
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken on line 8--8 of FIG. 2.
The broken line drawing in FIGS. 1, 3, and 5-8 of the processor package is for illustrative purposes only and forms no part of the claimed design.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 22 1997 | Intel Corporation | (assignment on the face of the patent) | / | |||
Mar 31 1998 | KLINKER, THOMAS S | Intel Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009101 | /0930 |
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