Patent
   D413316
Priority
Dec 22 1997
Filed
Dec 22 1997
Issued
Aug 31 1999
Expiry
Aug 31 2013
Assg.orig
Entity
unknown
7
22
n/a
The ornamental design for a processor package cover plate for an integrated circuit processor package chipset, as shown and described.

FIG. 1 is a perspective view of a processor package cover plate for an integrated circuit processor package chipset;

FIG. 2 is a front view thereof.

FIG. 3 is a top view thereof.

FIG. 4 is a back view thereof.

FIG. 5 is a right side view thereof.

FIG. 6 is a left side view thereof.

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a cross-sectional view thereof, taken on line 8--8 of FIG. 2.

The broken line drawing in FIGS. 1, 3, and 5-8 of the processor package is for illustrative purposes only and forms no part of the claimed design.

Klinker, Thomas S.

Patent Priority Assignee Title
8880283, Mar 14 2013 DRS C3 & Aviation Company Deployable flight recorder
D426201, Dec 22 1997 Intel Corporation Processor package
D426835, Dec 28 1997 Sharp Kabushiki Kaisha Protector for an electronic computer
D436357, Aug 19 1998 Intel Corporation Processor package
D701207, Mar 14 2013 DRS C3 & Aviation Company Deployable flight recorder housing
D866560, Jan 12 2018 Intel Corporation Peripheral component interconnect card panel
D876443, Jan 12 2018 Intel Corporation Peripheral component interconnect card panel set
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Dec 22 1997Intel Corporation(assignment on the face of the patent)
Mar 31 1998KLINKER, THOMAS S Intel CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0091010930 pdf
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