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The ornamental design for a processor package, as shown and described. |
FIG. 1 is a perspective view of a processor package including an indented area on a surface.
FIG. 2 is a front view of the processor package.
FIG. 3 is a top view of the processor package.
FIG. 4 is a back view of the processor package.
FIG. 5 is a right side view of the processor package.
FIG. 6 is a left side view of the processor package.
FIG. 7 is a bottom view of the processor package; and,
FIG. 8 is a cross-sectional view of the processor package taken along line 8--8 in FIG. 2.
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Aug 13 1998 | KLINKER, THOMAS S | Intel Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009411 | /0872 | |
Aug 19 1998 | Intel Corporation | (assignment on the face of the patent) | / |
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