Patent
   D405772
Priority
Nov 15 1996
Filed
Nov 15 1996
Issued
Feb 16 1999
Expiry
Feb 16 2013
Assg.orig
Entity
unknown
4
24
n/a
The ornamental design for a processor package cover plate, as shown and described.

FIG. 1 is a perspective view of a processor package cover plate including an indented area on a surface of the processor package cover plate, the flat region at the bottom of the indented area comprising a holographic image represented by oblique line shading;

FIG. 2-4 are front, top, and back views, respectively, of the processor package cover plate, the flat region at the bottom of the indented area in FIG. 2 comprising a holographic image represented by oblique line shading;

FIG. 5-7 are right, left, and bottom views, respectively, of the processor package cover plate; and,

FIG. 8 is a cross-sectional view of the processor package cover plate taken along line 8-8 of FIG. 2.

The processor package is shown in broken lines in the views for illustrative purposes only and forms no part of the claimed design.

Klinker, Thomas S.

Patent Priority Assignee Title
D413315, Dec 22 1997 Intel Corporation Processor package cover plate for an integrated circuit processor package chipset
D436357, Aug 19 1998 Intel Corporation Processor package
D866560, Jan 12 2018 Intel Corporation Peripheral component interconnect card panel
D876443, Jan 12 2018 Intel Corporation Peripheral component interconnect card panel set
Patent Priority Assignee Title
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Executed onAssignorAssigneeConveyanceFrameReelDoc
Nov 15 1996Intel Corporation(assignment on the face of the patent)
Feb 22 1997KLINKER, THOMAS S Intel CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0083850515 pdf
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