The ornamental design for a processorpackagecoverplate, as shown and described.
FIG. 1 is a perspective view of a processor package cover plate including
an indented area on a surface of the processor package cover plate, the
flat region at the bottom of the indented area comprising a holographic
image represented by oblique line shading;
FIG. 2-4 are front, top, and back views, respectively, of the processor
package cover plate, the flat region at the bottom of the indented area in
FIG. 2 comprising a holographic image represented by oblique line shading;
FIG. 5-7 are right, left, and bottom views, respectively, of the processor
package cover plate; and,
FIG. 8 is a cross-sectional view of the processor package cover plate taken
along line 8-8 of FIG. 2.
The processor package is shown in broken lines in the views for
illustrative purposes only and forms no part of the claimed design.