Processor package cover plate for an integrated circuit processor package chipset

Abstract

Description

FIG. 1 is a perspective view of a cover plate on a processor package including an indented area on a surface of the cover plate.

FIG. 2 is a front view thereof.

FIG. 3 is a top view thereof.

FIG. 4 is a back view thereof.

FIG. 5 is a right side view thereof.

FIG. 6 is a left side view thereof.

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a cross-sectional view thereof, taken on line 8--8 of FIG. 2.

The broken line drawing in FIGS. 1, 3, and 5-8 of the processor package is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a processor package cover plate for an integrated circuit processor package chipset, as shown and described.