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Patent
D413109
Priority
Nov 15 1996
Filed
Nov 15 1996
Issued
Aug 24 1999
Expiry
Aug 24 2013
Assg.orig
Entity
unknown
10
24
n/a
The ornamental design for a processor package cover plate , as shown and described.
FIG. 1 is a perspective view of a processor package cover plate on a
processor package including an indented area on the surface of the
processor package cover plate;
FIG. 2-4 are front, top, and back views, respectively, of the processor
package cover plate on the processor package;
FIG. 5-7 are right, left, and bottom views, respectively, of the processor
package cover plate on the processor package; and,
FIG. 8 is a cross sectional view of the processor package cover plate on
the processor package taken along line 8--8 of FIG. 2.
The processor package is shown in broken lines in the views for
illustrative purposes only and forms no part of the claimed design.
Klinker, Thomas S.
Patent
Priority
Assignee
Title
D436357 ,
Aug 19 1998
Intel Corporation
Processor package
D465482 ,
Nov 27 2001
Vertu Corporation Limited
Frame for a handset
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Compal Electronics Inc.
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Mar 15 2013
CREATIVE TECHNOLOGY LTD
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CREATIVE TECHNOLOGY LTD
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CREATIVE TECHNOLOGY LTD
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Dec 04 2013
Cisco Technology, Inc.
Electrical equipment housing
D866560 ,
Jan 12 2018
Intel Corporation
Peripheral component interconnect card panel
D876443 ,
Jan 12 2018
Intel Corporation
Peripheral component interconnect card panel set
Patent
Priority
Assignee
Title
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Nortel Networks Limited
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Sega Enterprises, Ltd.
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Date
Maintenance Fee Events
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Date
Maintenance Schedule
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