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The ornamental design for a case for a component, as shown and described. |
FIG. 1 is a perspective view of a first embodiment of a case for a component showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof;
FIG. 7 is a rear elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of a case for a component;
FIG. 9 is a top plan view thereof;
FIG. 10 is a left side elevational view thereof;
FIG. 11 is a front elevational view thereof;
FIG. 12 is a bottom plan view thereof; and,
FIG. 13 is a right side elevational view thereof. The rear elevation view of the second embodiment is the same as the rear elevational view of the first embodiment.
The rear elevational view of the second embodiment (FIG. 8) is same as that of FIG. 7 of the first embodiment.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Feb 26 1997 | SUZUKI, YUKO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008567 | /0152 | |
Feb 28 1997 | Sony Corporation | (assignment on the face of the patent) | / |
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