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The ornamental design for a package for earphone, as shown. |
FIG. 1 is a front elevation of a package for earphone showing my new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a left-side elevation thereof;
FIG. 4 is a right-side elevation thereof;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a sectional elevation taken along line 7--7 of FIG. 1; and
FIG. 8 is a sectional elevation taken along line 8--8 of FIG. 1.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 16 1988 | Sony Corporation | (assignment on the face of the patent) | / | |||
Oct 20 1988 | NAGASAKA, YOSHIE | SONY CORPORAITON, A CORP OF JAPAN | ASSIGNMENT OF ASSIGNORS INTEREST | 004984 | /0323 |
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