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The ornamental design for a case for a component, as shown and described. |
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FIG. 1 is a perspective view of a case for a component showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a right side elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
| Patent | Priority | Assignee | Title |
| D747964, | Nov 13 2013 | AVENTIS HOLDINGS INC ; Aventisub II Inc; AVENTISUB LLC; AVENTISUB INC | Package for medical device |
| D817780, | May 20 2016 | RECKITT BENCKISER HEALTH LIMITED | Blister package |
| D819455, | May 20 2016 | RECKITT BENCKISER HEALTH LIMITED | Blister package |
| Patent | Priority | Assignee | Title |
| 3092245, | |||
| 3369660, | |||
| 4466534, | Sep 13 1982 | Display packages | |
| 4648509, | Jul 14 1986 | Tamper-proof package and method | |
| 5494168, | May 12 1994 | NATIONAL ELECTRONICS CORP | Surface mount component dispensing system |
| D290582, | Mar 20 1985 | Ex-Cell Home Fashions, Inc. | Display box |
| D298742, | Dec 10 1985 | Rokina Optical Co., Inc. | Display package for auxiliary lens |
| D313554, | Jan 26 1988 | Package for medical contents | |
| D313753, | Mar 17 1988 | SONY CORPORAITON, A CORP OF JAPAN | Package for earphone |
| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Feb 26 1997 | SUZUKI, YUKO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 008498 | /0033 | |
| Feb 28 1997 | Sony Corporation | (assignment on the face of the patent) | / |
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