Patent
   D425483
Priority
Jun 30 1998
Filed
Jun 30 1998
Issued
May 23 2000
Expiry
May 23 2014
Assg.orig
Entity
unknown
38
6
n/a
The ornamental design for a interconnection device, as shown and described.

FIG. 1, is a top right hand perspective of a first embodiment of the present invention;

FIG. 2 is a top plan view of the first embodiment;

FIG. 3 is a left side elevation of the present embodiment;

FIG. 4 is a front elevation of the first embodiment;

FIG. 5 is a right side elevation of the first embodiment;

FIG. 6 is a back elevation of the first embodiment;

FIG. 7 is a top, right hand perspective of a second embodiment of the present invention;

FIG. 8 is a top plan view of the second embodiment;

FIG. 9 is a front elevation of the second embodiment;

FIG. 10 is a right side elevation of the second embodiment, the left side being a mirror image; and,

FIG. 11 is a back elevation of the second embodiment.

Bechtold, Kenneth V., Sanders, S. Todd, Adkins, Michael L.

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Executed onAssignorAssigneeConveyanceFrameReelDoc
Jun 30 1998Honeywell Inc.(assignment on the face of the patent)
Jul 15 1998BECHTOLD, KENNETH V Honeywell INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0094670616 pdf
Jul 15 1998SANDERS, S TODDHoneywell INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0094670616 pdf
Jul 17 1998ADKINS, MICHAEL L Honeywell INCASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0094670616 pdf
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