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The ornamental design for a interconnection device, as shown and described. |
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FIG. 1, is a top right hand perspective of a first embodiment of the present invention;
FIG. 2 is a top plan view of the first embodiment;
FIG. 3 is a left side elevation of the present embodiment;
FIG. 4 is a front elevation of the first embodiment;
FIG. 5 is a right side elevation of the first embodiment;
FIG. 6 is a back elevation of the first embodiment;
FIG. 7 is a top, right hand perspective of a second embodiment of the present invention;
FIG. 8 is a top plan view of the second embodiment;
FIG. 9 is a front elevation of the second embodiment;
FIG. 10 is a right side elevation of the second embodiment, the left side being a mirror image; and,
FIG. 11 is a back elevation of the second embodiment.
Bechtold, Kenneth V., Sanders, S. Todd, Adkins, Michael L.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jun 30 1998 | Honeywell Inc. | (assignment on the face of the patent) | / | |||
| Jul 15 1998 | BECHTOLD, KENNETH V | Honeywell INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009467 | /0616 | |
| Jul 15 1998 | SANDERS, S TODD | Honeywell INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009467 | /0616 | |
| Jul 17 1998 | ADKINS, MICHAEL L | Honeywell INC | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 009467 | /0616 |
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