High density interconnection device

Abstract

Description

FIG. 1 is a rear perspective view illustrating a high density interconnection device in accordance with one embodiment of the invention.

FIG. 2 is a front perspective view of the high density interconnection device of FIG. 1.

FIG. 3 is a front elevation view of the high density interconnection device of FIG. 1.

FIG. 4 is a rear elevation view of the high density interconnection device of FIG. 1.

FIG. 5 is a first side elevation view of the high density interconnection device of FIG. 1.

FIG. 6 is a second side elevation view of the high density interconnection device of FIG. 1.

FIG. 7 is a top plan view of the high density interconnection device of FIG. 1.

FIG. 8 is a bottom plan view of the high density interconnection device of FIG. 1.

FIG. 9 is a rear perspective view illustrating a high density interconnection device in accordance with another embodiment of the invention.

FIG. 10 is a front perspective view of the high density interconnection device of FIG. 9.

FIG. 11 is a front elevation view of the high density interconnection device of FIG. 9.

FIG. 12. is a rear elevation view of the high density interconnection device of FIG. 9.

FIG. 13 is a first side elevation of the high density interconnection device of FIG. 9.

FIG. 14 is a second side elevation view of the high density interconnection device of FIG. 9.

FIG. 15 is a top plan view of the high density interconnection device of FIG. 9; and,

FIG. 16 is a bottom plan view of the high density interconnection device of FIG. 9.

The broken line portions of the disclosure are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design of a high density interconnection device, as shown and described.