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The ornamental design for a processor and display module for a modular measurement instrument, as shown and described. |
The ornamental design disclosed in this application is for a processor and display module for a modular for a modular measurement instrument having raised bumper guards at the corners of the module, and a bi-level rear surface.
FIG. 1 is a perspective view of a processor and display module for a modular measurement instrument;
FIG. 2 is a front elevation view of the processor and display module for a modular measurement instrument;
FIG. 3 is a rear elevation view of the processor and display module for a modular measurement instrument;
FIG. 4 is a left side elevation view of the processor and display module for a modular measurement instrument;
FIG. 5 is a right side elevation view of the processor and display module for a modular measurement instrument.
FIG. 6 is a top plan view of the processor and display module for a modular measurement instrument; and,
FIG. 7 is a bottom plan view of the processor and display module for a modular measurement instrument.
Wrisley, Jerry L., McGrath, Jr., James H.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Mar 13 2000 | Tektronix, Inc. | (assignment on the face of the patent) | / | |||
Mar 13 2000 | WRISLEY, JERRY L | Tektronix, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011737 | /0187 | |
Mar 13 2000 | MCGRATH, JAMES H JR | Tektronix, Inc | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011737 | /0187 |
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