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The ornamental design for a headphone, as shown and described. |
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FIG. 1 is a perspective view of a headphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a bottom plan view thereof;
FIG. 4 is a left side elevational view thereof;
FIG. 5 is a right side elevational view thereof;
FIG. 6 is a front elevational view thereof; and,
FIG. 7 is a rear elevational view thereof.
FIG. 8 is a perspective view of another embodiment of a headphone showing my new design;
FIG. 9 is a top plan view thereof;
FIG. 10 is a bottom plan view thereof;
FIG. 11 is a left side elevational view thereof;
FIG. 12 is a right side elevational view thereof;
FIG. 13 is a front elevational view thereof; and,
FIG. 14 is a rear elevational view thereof.
The broken line showing on FIGS. 1-14 is for illustrative purposes only and forms no part of the claimed design.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Jul 27 2000 | MORI, AKINARI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 011119 | /0857 | |
| Aug 15 2000 | Sony Corporation | (assignment on the face of the patent) | / |
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