|
The ornamental design for a headphone combined with a microphone, as shown and described. |
FIG. 1 is a perspective view of a first embodiment of the headphone combined with a microphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a rear elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a left side elevational view thereof;
FIG. 7 is a right side elevational view thereof;
FIG. 8 is a perspective view of a second embodiment of FIG. 1;
FIG. 9 is a top plan view thereof shown in FIG. 8;
FIG. 10 is a front elevational view thereof shown in FIG. 8;
FIG. 11 is a rear elevational view thereof shown in FIG. 8;
FIG. 12 is a bottom plan view thereof shown in FIG. 8;
FIG. 13 is a left side elevational view thereof shown in FIG. 8; and,
FIG. 14 is a right side elevational view thereof shown in FIG. 8.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Sep 07 1995 | HAYASHI, HARUO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007650 | 0519 | |
Sep 13 1995 | Sony Corporation | (assignment on the face of the patent) |
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