Patent
   D531170
Priority
Nov 07 2005
Filed
Nov 07 2005
Issued
Oct 31 2006
Expiry
Oct 31 2020
Assg.orig
Entity
unknown
4
13
n/a
The ornamental design for a portion of a headphone, as shown and described.

FIG. 1 is a perspective of a portion of a headphone showing my new design;

FIG. 2 is an elevational view thereof;

FIG. 3 is a side elevational view, the opposite side being a mirror image thereof; and,

FIG. 4 is a top plan view, the bottom view being substantially a mirror image thereof.

The broken line showings of the three circles on the lower portion of the headphone and the clip are for illustrative purposes only and form no part of the claimed design.

Solland, Kurt

Patent Priority Assignee Title
D557208, Sep 18 2006 Harman International Industries, Incorporated Audio and charging station for a handheld electronic device
D760905, Jul 08 2015 MMD HONG KONG HOLDING LIMITED Mushroom form ear tip
D768860, Jul 08 2015 MMD HONG KONG HOLDING LIMITED Tree form ear tip
D862422, Dec 29 2017 Harman International Industries, Incorporated Headphone
Patent Priority Assignee Title
3051961,
3457565,
3720787,
4160135, Apr 15 1977 AKG Akustische u.Kino-Gerate Gesellschaft m.b.H. Closed earphone construction
5023955, Apr 13 1989 Gentex Corporation Impact-absorbing sound-attenuating earcup
D376598, Sep 13 1995 Sony Corporation Headphone combined with microphone
D391575, Apr 21 1995 David Clark Company Inc. Headset earcup
D457874, Jun 29 2001 Sony Corporation Headphone
D463398, Jan 12 2001 GN NETCOM A S Double spring band for a headset
D463791, Jun 06 2001 NEC Corporation Wireless headphone
D465779, Nov 13 2001 HARMAN INTERNATIONAL INDUSTRIES, INC Speaker grill
D484868, Feb 11 2003 Sony Corporation Headphone
D488461, Mar 03 2003 Matsushita Electric Industrial Co., Ltd. Earphone with microphone
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