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The ornamental design for a headphone, as shown and described. |
FIG. 1 is a perspective view of a first embodiment of a headphone showing my new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a left side elevational view thereof, a right side elevational view being a mirror image;
FIG. 4 is a front elevational view thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is a rear elevational view thereof;
FIG. 7 is a perspective view of a second embodiment of a headphone showing my new design;
FIG. 8 is a top plan view thereof;
FIG. 9 is a left side elevational view thereof, a right side elevational view thereof being a mirror image;
FIG. 10 is a front elevational view thereof;
FIG. 11 is a bottom plan view thereof; and,
FIG. 12 is a rear elevational view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jan 30 1998 | Sony Corporation | (assignment on the face of the patent) | / | |||
Mar 18 1999 | YASUTOMI, HIROSHI | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 010307 | /0962 |
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