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The ornamental design for headphone, as shown and described. |
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FIG. 1 is a top, front and right-side perspective view of a headphone, showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a right-side elevational view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
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| Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
| Apr 27 1994 | HAYASHI, HARUO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 006996 | /0541 | |
| May 11 1994 | Sony Corporation | (assignment on the face of the patent) | / |
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