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The ornamental design for a headset assembly, as shown and described.
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FIG. 1 is a front perspective view of a headset assembly of the present invention;
FIG. 2 is a bottom view thereof;
FIG. 3 is a top view thereof;
FIG. 4 is a first side view thereof;
FIG. 5 is a second side view thereof;
FIG. 6 is a front view thereof; and,
FIG. 7 is a back view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Jun 10 2003 | ASAI, YOSHIHIKO | MATSUSHITA ELECTRIC INDUSTRIAL CO , LTD | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 014251 | /0327 | |
Jun 27 2003 | Matsushita Electric Industrial Co., Ltd. | (assignment on the face of the patent) | / |
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