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The ornamental design for headphone, as shown and described. |
FIG. 1 is a top plan view of a headphone showing my new design;
FIG. 2 is a right-side elevational view thereof;
FIG. 3 is a front elevational view thereof;
FIG. 4 is a left-side elevational view thereof;
FIG. 5 is a rear elevational view thereof;
FIG. 6 is a bottom plan view thereof; and,
FIG. 7 is a top, front and left-side perspective view thereof.
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Executed on | Assignor | Assignee | Conveyance | Frame | Reel | Doc |
Dec 28 1995 | TSUGE, TAKAHIRO | Sony Corporation | ASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS | 007859 | /0663 | |
Jan 16 1996 | Sony Corporation | (assignment on the face of the patent) | / |
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