Patent
   D616418
Priority
Jul 15 2009
Filed
Jul 15 2009
Issued
May 25 2010
Expiry
May 25 2024
Assg.orig
Entity
unknown
34
21
n/a
The ornamental design for a headset, as shown and described.

FIG. 1 is a perspective view of a headset showing my new design, the opposite perspective view is a mirror image, the interior surfaces of the openings are unornamented;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Portions of FIGS. 1–7 that are shown as broken lines are for illustrative purpose only and form no part of the claimed design.

Morisawa, Rui

Patent Priority Assignee Title
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D764437, Apr 07 2015 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset
D765056, Apr 07 2015 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset or headphone
D812037, Dec 01 2016 Zound Industries International AB Foldable headphone
D830333, Feb 14 2017 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset or headphone
D830334, Feb 14 2017 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset or headphone
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D885364, Sep 19 2018 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset
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D927452, Sep 19 2018 HEWLETT-PACKARD DEVELOPMENT COMPANY, L P Communications headset or headphone
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D976228, Oct 13 2020 Anker Innovations Technology Co., Ltd.; ANKER INNOVATIONS TECHNOLOGY CO LTD Headphone bracket
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//
Executed onAssignorAssigneeConveyanceFrameReelDoc
Jul 15 2009Sony Corporation(assignment on the face of the patent)
Aug 17 2009MORISAWA, RUISony CorporationASSIGNMENT OF ASSIGNORS INTEREST SEE DOCUMENT FOR DETAILS 0233250655 pdf
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