FIG. 1 is a perspective and environmental view of a pair of headphone covers according to the present invention illustrated as being connected to headphones.
FIG. 2 is a front elevation and environmental view of the pair of headphone covers illustrated in FIG. 1 illustrated as being connected to headphones.
FIG. 3 is a rear elevation and environmental view of the pair of headphone covers illustrated in FIG. 1 illustrated as being connected to headphones.
FIG. 4 is a side elevation and environmental view of the pair of headphone covers illustrated in FIG. 1 illustrated as being connected to headphones.
FIG. 5 is another side elevation and environmental view of the pair of headphone covers illustrated in FIG. 1 illustrated as being connected to headphones.
FIG. 6 is a top plan and environmental view of the pair of headphone covers illustrated in FIG. 1 illustrated as being connected to headphones.
FIG. 7 is a bottom plan and environmental view of the pair of headphone covers illustrated in FIG. 1 illustrated as being connected to headphones.
FIG. 8 is a perspective view of a headphone cover according to the present invention.
FIG. 9 is a side elevation view of the headphone cover illustrated in FIG. 8.
FIG. 10 is another side elevation view of the headphone cover illustrated in FIG. 8.
FIG. 11 is a rear elevation view of the headphone cover illustrated in FIG. 8.
FIG. 12 is front elevation view of the headphone cover illustrated in FIG. 8.
FIG. 13 is a top plan view of the headphone cover illustrated in FIG. 8; and,
FIG. 14 is bottom plan view of the headphone cover illustrated in FIG. 8.
The broken lines in FIGS. 1-7 depict headphones having a connected microphone that do not form a claimed feature of the present invention.
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